DIKW2022: Data, Information, Knowledge and Wisdom Chengdu, China, December 18-20, 2022 |
Conference website | http://www.ieee-cybermatics.org/2022/dikw/ |
Abstract registration deadline | September 20, 2022 |
Submission deadline | September 20, 2022 |
[Our apologies if you receive multiple copies of this CFP]
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The 2022 IEEE International Conference on Data, Information, Knowledge and Wisdom (DIKW-2022)
Chengdu, China
December 18-20, 2022
http://www.ieee-cybermatics.org/2022/dikw/
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Dear colleagues/friends,
Hope you are well and healthy. The IEEE DIKW-2022 International Conference on Data, Information, Knowledge and Wisdom was planned to be held at Chengdu, China, December 18-20, 2022. You are cordially invited to submit your latest research results to the IEEE DIKW-2022 Conference:http://www.ieee-cybermatics.org/2022/dikw/
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INTRODUCTION
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Data, Information, Knowledge and Wisdom, in short (DIKW), have been used widely as marking terms in various domains for expressing and exchanging semantic or conceptual subjective or objective understandings. However, there are still no unified understandings over the meaning of the DIKW concepts. Data, Information, Knowledge, and Wisdom as a whole concept of DIKW is also missing unified understandings of the relationships among them. Therefore, there have been proposals and models of DIKW as “layered hierarchy”, “architecture”, “framework”, “network”,“thinking mode”,“pattern”,“style”,“theory”,“methodology”,“model”,“graph”, etc.
IEEE DIKW-2022 Conference is co-organized by Sichuan Association for Science and Technology and the DIKW research group of Sichuan University, aims to bring together scientists, researchers, and industrial engineers to exchange experimental and theoretical Data/ Information/Knowledge/Wisdom modeling and processing results, novel designs, explainable AI, AI governance, work-in-progress and case studies on theories, design mechanisms and extensions on DIKW transformations and interactions in all areas, in all phases, empirical or theoretical solutions. IEEE DIKW-2022 is sponsored by IEEE, IEEE Computer Society, and IEEE Technical Committee on Scalable Computing (TCSC). In view of all considerations, this conference will be held together with 5 other high-quality conferences. The specific conference titles and related links are listed below:
- The 23rd IEEE International Conference on High Performance Computing and Communications (HPCC-2022): http://www.ieee-hpcc.org/2022/
- The 8th IEEE International Conference on Data Science and Systems (DSS-2022): http://www.ieee-cybermatics.org/2022/dss/
- The 18th IEEE International Conference on Embedded Software and Systems (ICESS-2022): http://www.ieee-cybermatics.org/2022/icess/
- The 20th IEEE International Conference on Smart City (Smart City-2022): http://www.ieee-cybermatics.org/2022/smartcity/
- The 8th IEEE International Conference on Dependability in Sensor, Cloud & Big Data Systems & Applications (DependSys-2022): http://www.ieee-cybermatics.org/2022/dependsys/
We hope you will join us for the great gathering and look forwards to seeing you in the beautiful city Chengdu!
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SCOPE AND TOPICS
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This conference will focus on (but not limited to) the following topics:- Theories, Algorithms and Platforms for Data Analytics and Information Retrieving- Data Provenance, Cleaning, Curation and Governance Services- Data, Information, Knowledge and Wisdom Sharing, Integration and Migration- Real-time Data Modeling and Information Provision Services and Applications- Data-driven Intelligent Decision-making and Innovative Applications- Goal or Purpose Models, Techniques and Tools for Smart Computing- Data Models, Information Semantics, Query languages- Data Stream Systems and Sensor Networks- Data Visualization and Interactive Data Exploration- Hybrid AI Privacy, Security, Trust, and Responsibility Provision- Data-Knowledge Mixed Processing Systems and Service Architecture- Domain Knowledge Modeling and Ontology-Building- Data, Information and Knowledge Transformation Load balance- DIKW content Storage and Retrieval and Interface Technology- Software Tools for Data-Information-Knowledge Quality Modeling and Testing- Computational Intelligence for Data, Information and Knowledge Hybrid Systems- Multimedia and Cross-modals "Databases" Processing- Development and Management of Heterogeneous Knowledge Bases- Knowledge Extraction, Discovery, Analysis and Representation- Application of Knowledge Representation Techniques to Semantic Modeling- Optimization Techniques of DIKW applications- Theories of DIKW Models and Performance Evaluation Approach
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SUBMISSION GUIDELINES
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http://www.ieee-cybermatics.org/2022/dikw/call4paper.html
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IMPORTANT DATES
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Special Session: Jun. 30, 2022
Paper Submission Deadline: Sep. 01, 2022
Author Notification: Oct. 15, 2022
Final Manuscript Due: Nov. 10, 2022
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ORGANIZING COMMITTEE
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General ChairsXifan Yao, South China Univ. of Tech., ChinaRiccardo Martoglia, FIM – Univ. of Modena, ItalyJunzhi Yu, Peking Univ., China
Steering CommitteeLaurence T. Yang, Hainan Univ., China (Chair)Yucong Duan, Hainan Univ., China (Chair)Wei Liu, Beijing Univ. of Posts and Telecom., ChinaCarl Chang, Iowa State Univ., USA
Program ChairsJing Yang, Hainan Univ., ChinaYuan Gao, Hainan Univ., China
Program Vice-ChairsMiao Li, Nat. Univ. of Def. Tech., ChinaQian Qiu, Henan Univ., China
Publicity ChairsLi Liu, Univ. of Pittsburgh, USADongyu Xin, Huazhong Univ. of Sci. and Tech., ChinaHao Wang, Huazhong Univ. of Sci. and Tech., China
Web ChairsJiaWei Wang, St. Francis Xavier Univ., CanadaTinghua Zhang, Hainan Univ., China
Best Regards!
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