IEEE ETCM 2019: 4th IEEE Ecuador Technical Chapters Meeting Escuela Superior Politécnica del Litoral ESPOL Guayaquil, Ecuador, November 12-15, 2019 |
Conference website | https://attend.ieee.org/etcm-2019/ |
Submission link | https://easychair.org/conferences/?conf=ieeeetcm2019 |
Submission deadline | July 31, 2019 |
Notification of Acceptance | September 30, 2019 |
Final Paper Submission | October 15, 2019 |
IEEE ETCM 2019 international conference aims to provide a comprehensive and highly prestigious venue for academics, engineers, and researchers in particular from Ecuador Technical Chapters fields of expertise.
The conference covers both theoretical and practical issues related to Communications, Computing, Computational Intelligence, Control Systems, Industrial Electronics, Engineering in Medicine and Biology, Power and Energy, Robotics and Automation, and Circuit, Systems and Electron Devices. Topics of interest, but not limited to, are:
Systems and Control
- Adaptive Systems, Signal Processing, Embedded Systems, Fault Tolerant Systems, Identification, Predictive Control
Industrial Electronics
- Power Converters, Power Semiconductors, Machines and Drives, Power Electronics in Transportation Systems, Power Electronics Applications
Communications
- Internet of Things, Communications Systems Security, Green Communications, Mobile and Wireless Networking, Next-Generation Networking, Optical Networks and Systems, Signal Processing, Access Networks and Systems, Cloud Networks, e-Health, Power Line Communications, Satellite and Space Communications
Computer and Software Engineering
- Security and Privacy, Semantic Computing, Real Time Systems, Computational Intelligence, Multimedia Computing, Learning Technologies, Distributed Processing, Data Engineering and Data Science, Human Computer Interaction, Computer Vision, Software Engineering, Software Design, Software Verification and Validation
Power and Energy
- Transmission, Distribution, Power Generation, Power System Control and Operation, Reliability, Stability, Renewables, Smart Grids
Engineering in Medicine and Biology
- Clinical Engineering, Telemedicine and Health Care, Bioinformatics, Biomechanics, Biomaterials, Bioinstrumentation, Signal and Image Processing, Biophysics, Nanomedicine, Nanomaterials, Cell and Molecular Biology, ImmunologyEngineering, Organs on a Chip, Bioimaging, Tissue Engineering & Artificial Organs, Genetic Engineering, Cardiovascular Engineering, Point-Of-Care Technologies
Robotics and Automation Systems
- Automation, Automation in Logistics and Supply Chain Management, Sensors, Robotics, Assistive Technologies, System Integration, Sensor/Actuator Networks, Distributed and Cloud Robotics, Autonomous Vehicles, Human/Robot Interaction
Circuits, Systems and Electron Devices
- Gate Dielectrics, CMOS Devices and Beyond, FDSOI, FinFET, NW, III-V, SiGe, LASER diode, LED, Memory devices (RERAM, PCM, MRAM etc.), CMOS M/NEMS and Sensors, Physics and Electrical characterization, Photovoltaic Devices, Power devices, High-Mobility and high frequency, circuits, Analog & RF & Mixed Signal, EDA, Verification and Test, Digital, Reconfigurable & Applications; Circuit Reliability, ESD and Latchup, IC architecture and VLSI design, Circuit Aging Simulation, Soft Errors, SoC, NoC, Embedded, Optoelectronics and Photonic, Energy harvesting, Modeling and Simulation.
Technology and Engineering Managenement
- Leveraging enterprise data, e.g. successful use of AI, analytics, blockchain, IoT. Enhancing Industry-University and /or Goverment collaborations.
Computational Intelligence (Co-located event IEEE LA-CCI 2019)
- Neural Networks, Fuzzy Systems, Evolutionary and Swarm Computation, Learning Systems, Data Science. This year’s Computational Intelligence topics will be cover by the IEEE LA-CCI 2019, please submit CI papers to LA-CCI 2019 http://la-cci.org/
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference.
We invite authors to submit high-quality full papers reporting original and novel research results on all the conference topics. Papers must be written in English, unpublished and not submitted elsewhere. Full papers must be limited to a maximum of 6 pages formatted using the IEEE ETCM double-column conference template and submitted exclusively in PDF through the conference submission system.
IEEE ETCM-2019 conference manuscript templates for word and LaTeX can be found here:
IEEE ETCM-2019 will handle a double blinded review process, which means that both the reviewer and author identities are concealed from the reviewers, and vice versa, throughout the review process. To facilitate this process, authors need to ensure that their manuscripts are prepared in a way that does not give away their identity. Thus your initial submission should NOT INCLUDE AUTHOR NAMES OR REFERENCE IN ANY FORM (INCLUIDING FILE NAME) TO AUTHORS. Papers which do not comply with this strict submission policy will be rejected.
IEEE Policy
IEEE reserves the right to exclude a paper from distribution after the conference (e.g., removal from IEEE Xplore®) if the paper is not presented at the conference. Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and IEEE ETCM will take action against any author who has engaged in either practice.
All papers will be cross-examined using anti-plagiarism automated software tools.
PLEASE NOTE: To be published in the IEEE ETCM 2019 Conference Proceedings and IEEE Xplore®, an author of an accepted paper is required to register for the conference. Non-refundable registration fees must be paid prior to uploading the final IEEE formatted, publication-ready version of the paper. For authors with multiple accepted papers, one full registration is valid for up to 2 papers. Accepted and presented papers will be published in the IEEE ETCM 2019 Conference Proceedings and submitted to IEEE Xplore®.
All questions about submissions should be emailed to our Program Chair, Dr. Oscar Camacho (oscar.camacho@epn.edu.ec), or to the conference email etcm@ieee.org
Committees
Organizing Committee
General Chair
Diego Benitez, IEEE Ecuador Section
Technical Program General Chair
Oscar Camacho, Escuela Politécnica Nacional (EPN)
Publication Chair
Omar Aguirre, Universidad San Francisco de Quito (USFQ)
Technical Chapters Tracks
Industrial Electronics & Control Systems Society Chapter
Patricio Cruz, Escuela Politécnica Nacional (EPN)
Power & Energy Society Chapter
Santiago Chamba, Centro Nacional de Control de la Energía (CENACE)
Engineering in Medicine and Biology Chapter
Jorge Alfredo Huquillas, Universidad Internacional del Ecuador (UIDE)
Mónica Huerta, Universidad Politécnica Salesiana (UPS)
Computer Society Chapter
Carlos Monsalve, Escuela Superior Politécnica del Litoral (ESPOL)
Communications Society Chapter
Jack Bravo, Universidad Politécnica Salesiana (UPS)
Robotics & Automation Society Chapter
Mariela Cerrada, Universidad Politécnica Salesiana (UPS)
Cicuit, Systems and Electron Devices Society Chapter (Invited Session)
Alberto Sánchez, Universidad San Francisco de Quito (USFQ)
Contact
All questions about submissions should be emailed to (oscar.camacho@epn.edu.ec), or at the conference email etcm@ieee.org