ICICSP 2020: 3rd IEEE International Conference on Information Communication and Signal Processing Shanghai Shanghai, China, September 12-15, 2020 |
Conference website | http://www.icsp.org |
Submission link | https://easychair.org/conferences/?conf=icicsp2020 |
Submission deadline | August 15, 2020 |
2020 3rd IEEE International Conference on Information Communication and Signal Processing (ICICSP 2020) will be held in Shanghai, China on September 12-15, 2020. ICICSP is initiated in 2018, and was held successfully in Nanyang Technological University, Singapore in 2018 and Shandong University (Weihai), China in 2019.
The applications of signal processing are vast and interdisciplinary-ranging from engineering to economics and astronomy to biology. The research in areas such as signal coding and de-noising have paved the path for these advancements. Recent decade has witnessed major revolution in communication and processing of digital media. As a consequence, solution to major problems in processing, transmission and reception have made signal processing an integral part of modern electronic and communication systems. Communication on the other hand plays major role in our day to day life. The communication technology helps in the advancement of modern systems to meet our need of efficient exchange of ideas. The current research includes the areas of cognitive radio and IOT.
As in the previous years, the conference is technically co-sponsored by the IEEE. Accepted and presented papers have been published in the conference proceedings by IEEE and submitted to IEEE Xplore.
List of Topics
- Topic 1 Embedded Reconfigurable, Evolvable Systems
- Topic 2 Algorithms and implementations
- Topic 3 Channel measurements and modelling
Committees
Honorary Chair
Prof. Hai Liu, Shandong University at Weihai, China
Advisory Committees
Prof. Yingchang Liang, University of Electronic Science and Technology of China, China
Prof. Albert WANG, University of California, USA
Program Chairs
Prof. Tianshu Qu, Peking University, China
Prof. Tetsuya Shimamura, Saitama University, Japan
Local Organizing Chair
Prof. Ruolun Liu, Shandong University at Weihai, China
Local Organizing Secretary
Assoc. Prof. Chengyou Wang, Shandong University at Weihai, China
International Conference Technical Committees
Assoc. Prof. Chris Joslin, Carleton University, Canada
Prof. Gang Qiao, Harbin Engineering University, China
Prof. Jinghua Li, Northwestern Polytechnical University, China
Prof. Quan Zhou, National Key Laboratory of Science and Technology on Space Microwave CAST, China
Prof. Yougen Xu, Beijing Institute of Technology, China
Invited Speakers
- Speaker 1 Prof. Alex Kot Chichung, IEEE Fellow, Nanyang Technological University, Singapore
- Speaker 2 Prof. Yuguang Fang, IEEE Fellow, University of Florida, USA
- Speaker 3 Prof. Fang Zheng, Tsinghua University, China
Publication
Submitted papers will be peer-reviewed by technical program committees based on the paper's topic, quality, etc. Accepted and presented papers will be published into conference proceedings, which will be included in IEEE Xplore, submitted and reviewed by Ei Compendex and Scopus Index.
Contact
Ms. Rachel Cao
Email: icspconference@163.com
Tel: +86-13880104217
For any question, please contact us by email or phone from 10 am—5:30 pm in the working days.