ICICSP 2019: 2019 2nd IEEE International Conference on Information Communication and Signal Processing Shandong University Weihai, China, September 28-30, 2019 |
Conference website | http://icsp.org/ |
Submission link | https://easychair.org/conferences/?conf=icsp2019 |
Submission deadline | August 10, 2019 |
Communication Systems worldwide have provided a rapidly growing and useful range of services and are continuing to evolve using a multitude of Signal Processing techniques. 2019 2nd IEEE International Conference on Information Communication and Signal Processing (ICICSP 2019) will be held in Shandong University, Weihai, China on September 28-30, 2019.
Submission Guidelines
Full Paper(publication and oral presentation)
Abstract(oral presentation only)
Electronic Submission System (.pdf)
http://www.easychair.org/conferences/?conf=icsp2019
List of Topics
Multidimensional Signal Processing
Radar Signal and Data Processing
Soft Computing Techniques
Speech and Video Processing
VLSI architectures for high speed processing
Management of multimedia services
Resource and information management
Diversity techniques
Reliability and Fault-Tolerance
Optical Communications
Cross Layer Design
Data integrity
Committees
International Conference Technical Committees
Prof. Aleksandr Cariow, West Pomeranian University of Technology, Szczecin, Poland
Assoc. Prof. Dr. Matsumoto Mitsuharu, University of Electro-communications, Japan
Asst. Prof. Yanhui Guo,University of Illinois Springfield, USA
Assoc. Prof. John T. Sheridan, University College Dublin, Ireland
Dr. Norhashimah bte Mohd Saad, Technical University of Malaysia, Melaka
Dr. Wan Nural Jawahir Hj Wan Yussof, Universiti Malaysia Terengganu, Malaysia
Assoc. Prof. Juan Avalo, Instituto Politécnico Nacional, Mexico
Assoc. Prof. Siti Norul Huda Sheikh Abdullah, University Kebangsaan Malaysia, Malaysia
Asst. Prof. Vladimir Georgiev, American University in Bulgaria, Bulgaria
Assoc. Prof. Dr. Chawalit Benjangkaprasert, King Mongkut’s Institute of Technology Ladkrabang, Thailand
Asst. Prof. Aashish A.Bardekar, Sipna College of Engineering & Technology, India
Dr. Ganchao Liu, Northwestern Polytechnical University, China
Invited Speakers
- Prof. Yingchang Liang, University of Electronic Science and Technology of China, China
Publication
Accepted and presented papers will be published into conference proceedings by IEEE , which will be included in IEEE Xplore, submitted and reviewed by Ei Compendex and Scopus Index.
Contact
Ms. Rachel Cao
Email: icspconference@163.com
Tel: +86-13880104217