IEEE ICEV 2020: 2020 IEEE International Conference on Engineering Veracruz Boca Del Rio, Veracruz, Mexico, October 26-29, 2020 |
Conference website | https://www.uv.mx/ieee-icev/ |
Submission link | https://easychair.org/conferences/?conf=ieeeicev2020 |
Abstract registration deadline | May 31, 2020 |
Submission deadline | May 31, 2020 |
2020 IEEE International Conference on Engineering Veracruz
(IEEE ICEV 2020)®
Smart Technologies under the Triple Helix Model of Innovation
Boca del Río, Veracruz, México – 26 to 29 October 2020
CALL FOR PAPERS
On behalf of the Organizing Committee, we have the pleasure to invite you to submit your contributions to the 2020 IEEE International Conference on Engineering Veracruz (IEEE ICEV 2020) (2020 IEEE Congreso Internacional de las Ingenierías Veracruz). The conference will be held in Boca del Río, Veracruz, Mexico from 26 to 29 October 2020, organized by the Universidad Veracruzana (DGAAT-Dirección General del Área Académica Técnica) and the IEEE Student Branches with the support of IEEE Veracruz Section, Consejo Veracruzano de Investigación Científica y Desarrollo Tecnológico (COVEICYDET), and Colegio de Ingenieros Mecánicos y Electricistas (CIME-Veracruz).
IEEE ICEV 2020 is technically sponsored by IEEE. Accepted papers will be submitted for inclusion into IEEE Xplore. Authors from all over the world are invited to submit original and unpublished papers, which are not under review in any other conference. All papers will be peer reviewed by the technical program committee. Submitted papers must be written in English and should be in PDF format. Paper length must be between 4 and 8 pages.
The ISBN of the conference proceedings for IEEE Xplore is:
978-1-7281-7474-7
which will be published under the copyright of IEEE.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference.
Papers must be submitted using the IEEE conference templates, available through the link:
https://www.uv.mx/ieee-icev/submission-of-papers/
All papers must be sent directly to the conference chair email: jaimartinez@uv.mx
(Temporarily)
under construction!!!!!
(All papers must be uploaded using EasyChair, following this link:)
https://easychair.org/conferences/?conf=ieeeicev2020
Important information
Paper Submission Deadline: |
May 31, 2020 |
Notification of acceptance: |
July 12, 2020 |
Camera-ready due: |
August 30, 2020 |
Registration and Payment Deadline for authors: |
September 30, 2020 |
Registration Deadline: |
October 26, 2020 |
Presentation of papers: |
26 to 29 October 2020 |
List of Topics
IEEE ICEV 2020 will deal with smart technologies under the triple helix model of innovation, i.e. the combined efforts of academia, industry and government for sustainable development using intelligent devices and technologies.
Authors are invited to submit contributions including, but not limited to the following areas:
- Power Engineering
- Materials Science and Engineering
- Nanomedicine and Biomedical Engineering
- Mechanical Engineering
- Electrical Engineering
- Electronic Engineering
- Mechatronics Engineering
- Chemical Engineering
- Computational Engineering
- Energy Harvesting
- Micro and nanosystems
- Micro and nanotechnology
- Communication systems
- Devices and sensors
- MEMS
- NEMS
- Application Specific Integrated Circuits (ASIC)
- Modelling and Simulation
- Internet of Things and Industry 4.0
- Electronic Instrumentation Engineering
- Signal Processing Engineering
- Physics and Optical Engineering
- Educational Innovation with Information and Communication Technologies
- Information Technologies in Organizations
- Information Technology Management
- Research, Innovation and Development in Organizations