nexgenran20: IEEE WCNC WORKSHOP ON Open-RAN: Open Road to Next Generation Mobile Networks https://www.ieeewcnc2020nexgenran.com/ Seoul, South Korea, April 6, 2020 |
Conference website | https://www.ieeewcnc2020nexgenran.com/ |
Abstract registration deadline | December 31, 2019 |
Submission deadline | December 31, 2019 |
Next Generation Radio Access Network provides a mechanism to interact with individual devices through radio-enabled advanced 5G network infrastructure. This robust network facilitates consumers with several types, and one of them discusses a unique feature called Open RAN that discusses the interoperability foundation between remote and centralized units of 5G base stations manufactured by diverse partners. Open RAN aims to evolve the infrastructure through enhancing its foundation with virtualized network elements, open interfaces that enable Intelligence in RAN. Also, an ecosystem of new products is almost ready to streamline the underpinnings of the multi-vendor functionality with additional software features of interoperability and autonomous access through Intelligence.
The main objective of this workshop is to bring out the research problems with possible solutions in Open RAN with the deployment of its main objectives and standardization for advanced 5G and networks beyond it. For that purpose, we are targeting an audience from both industry and academia to collect a variety of on-going research issues under a broad scope of Open-RAN. Also, we aim to facilitate the participants with on-going useful tutorials as well as a deep understanding of business directions, revenue generation, and industrial trends of these technologies.
List of Topics
Open-RAN Infrastructure:
- Next-generation heterogeneous radio access networks
- Cell coordination evaluation in Open-RAN
- Advanced waveform and channel coding through Open-RAN
- Tier and layered division multiplexing in Open-RAN
- Loading balancing and traffic steering in Open-RAN
- Architectural Optimization techniques in Open-RAN
- Cloud-based Open-RAN architectures
- Virtualization in Open-RAN architectures
- Fronthaul Interfaces in Open-RAN architectures
- 3rd Generation Partnership Project (3GPP) based novel Open-RAN architectures
- Openstack, Kubernetes, and ONAP distributed cloud architectures
Modeling and analysis:
- Modeling and impact analysis of Open-RAN
- Broadcasting through next-generation intelligent radio access networks
- Theory and implementation for inter-operable convergence of Open-RAN alliance devices
- Ultra-low latency modeling techniques of the 3rd Generation Partnership Project (3GPP) for Open-RAN
- Ultra-high throughput modeling techniques for consumer appliances for Open-RAN
- Voice and data-based scaling techniques of transactions
- Coverage capacity optimization modeling in Open-RAN
- Mobility Robustness Optimization modeling in Open-RAN
- Paging Optimization modeling in Open-RAN
- RACH optimization modeling in Open-RAN
- Network slice modeling in Open-RAN
- Split modeling for NFVI/VIM in Open-RAN
- Lightweight and real-time modeling for Open Source Communities (QEMU, OpenStack, k8S, Akriano, ONAP and OPNFV)
- Role of Mobile Edge Computing in Open-RAN
- Congestion control modeling in Open-RAN
- Scheduling techniques in Open-RAN
- QoS and mobile management aspects in Open-RAN
- Edge integration in Open-RAN
Intelligent Machine Learning:
- Open-RAN efficient signaling and control management techniques
- 5G and networks beyond channel estimation techniques
- Robust inter-operable transceiver architecture
- Real-time and non-real-time Intelligent Controllers
- Machine learning use cases for Open-RAN
- Virtualized scaling techniques of Open-RAN
- Cloud-centric Open-RAN intelligent controllers
- Machine-type communication (MTC) in Open-RAN
- Inter-operator Orchestration in Open-RAN
- Intelligent Network Slicing techniques
- Intelligent Mobile Edge node computing
- Deep Learning aspects in Open-RAN
- Intelligent Radio Connection Management
Committees
General Chairs
- Dr. Intaik Park
- Dr. Sukhdeep Singh
- Prof. Nawab Muhammad Faseeh Qureshi
General Co-Chairs
- Dr. JinGuk Jeong
- Prof. Wan Choi
- Prof. Abhay Karandikar
Steering Committee Chair
- Dr. Sunghyun Choi
Steering Committee Members
- Jayasuryan Iyer
- Pranav Jha
- Avinash Bhat
- Prof. Dr. Bhawani Shankar Chowdhry
TCP Chairs
- Prof. Navrati Saxena
- Dr. Ali Kashif Bashir
Technical Program Committee
- Dr. Abhishek Roy, Senior Technical Manager, MediTeak Inc., USA
- Prof. Harpreet Dhillon, Associate Professor, Virginia Tech, USA
- Prof. Yulie Wu, Assistant Professor, University of Exeter, UK
- Dr. Pankaj Thorat, Chief Engineer, Samsung R&D India - Bangalore (SRI-B), India
- Mr. Madhan Raj, Chief Engineer, Samsung R&D India-Bangalore (SRI-B), India
- Prof. Jun-Pyo Hong, Associate Professor, Pukyong National University, South Korea
- Prof. Seong Ho Chae, Assistant Professor, Korea Polytechnic University, South Korea
- Prof. Jung Hoon Lee, Assistant Professor, Hankuk University of Foreign Studies, South Korea
- Dr. Shapna Muralidharan, Post Doctoral Fellow, Korea Institute of Science & Technology, South Korea
- Dr. Bharat JR Sahu, Post Doctoral Fellow, Kyungpook National University, South Korea
- Prof. Isma Farah Siddiqui, Mehran University of Engineering & Technology (MUET), Jamshoro, Pakistan
- Prof. Waleed Ejaz, Thompson Rivers University, Canada.
- Dr. Ihsan Ullah Khan, Post Doctoral Fellow, Sungkyunkwan University, South Korea
- Prof. Muhammad Attique, Sejong University, South Korea
- Prof. Muhammad Tabish Niaz, Sejong University, South Korea
- Prof. Muhammad Farooque Khan, Sejong University, South Korea
- Prof. Qasim Ali Arain, Mehran University of Engineering & Technology (MUET), Jamshoro, Pakistan
- Prof. Faisal Karim Shaikh, Mehran University of Engineering & Technology (MUET), Jamshoro, Pakistan
- Dr. Muhammad Atif, Post Doctoral Fellow, Korea Institute of Science & Technology, South Korea
Submission Guidelines
All submissions should be written in English with a maximum paper length of eight (8) printed pages (10-point font) including figures. The papers exceeding 6 pages will be subject to an additional US$100 fee/page. Papers exceeding 8 pages will not be accepted at EDAS.
When preparing your manuscript, please pay also attention to the following:
- If your paper has been prepared using Microsoft Word, please ensure that you have used the most current version which will help reduce word-to-pdf conversion issues such as embedded fonts, bookmarks, etc.
- No page numbers and no headers/footers.
- Use non-zero PDF top and bottom margins (typically at least 0.5 inches/12.7 mm) to help indicate if there are any page numbers.
Papers should be submitted through EDAS by clicking here.
Download the Standard IEEE conference templates for LaTeX formats >>
You can also use the sample template for Microsoft Word: A4, US letter.
Please contact the Publication Chair if you have any questions about submitting your manuscripts.
Venue
Seoul, South Korea.
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