PAINE-2022: Ieee International Conference on Physical Assurance and Inspection of Electronics Huntsville, AL, United States, October 25-27, 2022 |
Conference website | https://paine-conference.org/ |
Submission link | https://easychair.org/conferences/?conf=paine2022 |
Submission deadline | July 21, 2022 |
Dear colleagues,
This is to inform you that the “IEEE International Conference on Physical Assurance and Inspection on Electronics” (PAINE), is to be held “in-person” from October 25-October 27, 2022 in Huntsville, AL. PAINE is supported by the “Reliability Society” and accepted papers will be published in IEEE Xplore after peer review by the PAINE TPC.
PAINE offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronic devices and systems safe and secure.
Topics covered are including but are not limited to:
- Security primitives: Novel devices, materials, and systems
- Trojans and backdoors: Detection and prevention
- Fault injection assessment and countermeasures
- Side-channel assessment (power, timing, EM) for assurance and countermeasures
- Analog & mixed-signal circuits and systems security
- FPGA Bitstream protection and vulnerabilities
- Emerging topics in physical inspection and assurance
- Counterfeit Detection and Anti-Counterfeit Technique
- Image analysis and artificial intelligence for assurance and inspection
- Novel material and devices for assurance
- Sample Preparation
- PCB trust and assurance
- Chip and PCB level decomposition for assurance
- FIB/SEM for assurance
- Electro-optical probing using PEM, EOP, EOFM, etc.
- Physical/side-channel fingerprinting
- Mod-chip on PCB
- Microprobing and nanoprobing
- Bus-snooping
- Field-based weakness
- Countermeasures against tampering and decomposition
- Physical/logical shielding etc.
SCHEDULE Full Paper (6 pages+1 page for references): July 21, 2022 Notification of Acceptance: August 18, 2022 Camera-ready version: September 15, 2022 |
CONTACT INFORMATION
Navid Asadi (Co-general Chair)University of FloridaE-mail: nasadi [at] ece [dot] ufl [dot] edu
Robert Overbeek (Co-general Chair)Radiance Technologies
Richard Ott (Vice General Chair)Air Force Research Laboratory
Waleed Khalil (Co-program Chair)Ohio State UniversityE-mail: khalil [dot] 18 [at] osu [dot] edu
Nick Hooten (Co-program Chair)Invariant Corporation
Ujjwal Guin (Vice Program Chair)Auburn UniversityE-mail: ujjwal [dot] guin [at] auburn [dot] edu
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Best Regards,
PAINE Organizing Committee