PAINE 2021: IEEE International Conference on Physical Assurance and Inspection of Electronics Marriot Crystal City Washington D.C., DC, United States, November 30-December 2, 2021 |
Conference website | http://paine-conference.org/ |
Submission link | https://easychair.org/conferences/?conf=paine2021 |
Submission deadline | August 9, 2021 |
Dear colleagues,
This is to inform you that the “IEEE International conference on Physical Assurance and Inspection on Electronics” (PAINE), is to be held “hybrid” on November 30-December 2, 2021 in Washington, DC. PAINE is supported by “Reliability Society” and accepted papers will be published in IEEE Xplore after peer review by the PAINE TPC.
PAINE offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronics devices and systems safe and secure.
Topics covered are including but not limited to:
- Security primitives: Novel devices, materials, and systems
- Trojans and backdoors: Detection and prevention
- Fault injection assessment and countermeasures
- Side channel assessment (power, timing, EM) for assurance and countermeasures
- Analog & mixed-signal circuits and systems security
- FPGA Bitstream protection and vulnerabilities
- Emerging topics in physical inspection and assurance
- Counterfeit Detection and Anti-Counterfeit Technique
- Image analysis and artificial intelligence for assurance and inspection
- Novel material and devices for assurance
- Sample Preparation
- PCB trust and assurance
- Chip and PCB level decomposition for assurance
- FIB/SEM for assurance
- Electro-optical probing using PEM, EOP, EOFM, etc.
- Physical/side channel fingerprinting
- Mod-chip on PCB
- Microprobing and nanoprobing
- Bus-snooping
- Field-based weakness
- Countermeasures against tampering and decomposition
- Physical/logical shielding etc.
SCHEDULE Full Paper (5 pages+1 page for references): Notification of Acceptance: August 11, 2021 Camera ready version: September 3, 2021 |
July 7, 2021 |
CONTACT INFORMATION
Technical Program: Navid Asadi (Program Chair)University of FloridaE-mail: nasadi@ece.ufl.edu
Technical Program: Waleed Khalil (Vice Program Chair)Ohio State UniversityE-mail: khalil.18@osu.edu
General Information: Mark Tehranipoor (General Chair)University of FloridaE-mail: tehranipoor@ece.ufl.edu
This event is open to public; we encourage everyone from academia, industry, and government to attend.
Sponsorship opportunities for the conference are available. If interested, please contact the Program or General Chair
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Best Regards,
PAINE Organizing Committee