SLIP 2021: 23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding Virtual Event, Germany, November 4, 2021 |
Conference website | http://www.sliponline.org/ |
Submission link | https://easychair.org/conferences/?conf=slip2021 |
Co-hosted with ACM/IEEE Intl. Conf. on Computer-Aided Design (ICCAD)
Co-sponsored by ACM SIGDA (tbc) and IEEE Computer Society TCVLSI
GENERAL INFORMATION
The 2021 ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP) is the 23rd edition of the Workshop. SLIP, co-located with ICCAD 2021, will bring together researchers and practitioners who have a shared interest in the challenges and futures of system-level interconnect, coming from wide-ranging backgrounds that span system, application, design and technology. The technical goal of the workshop is to (1) identify fundamental problems, and (2) foster new pathfinding of design, analysis, and optimization of system-level interconnects with emphasis on system-level interconnect modeling and pathfinding, DTCO-enhanced interconnect fabrics, memory and processor communication links, novel dataflow mapping for machine learning, 2.5/3D architectures, and new fabrics for the beyond-Moore era. Original submissions in the form of regular technical papers, invited sessions (tutorials, panels, special-topic sessions), workshop discussion topics, and posters are welcome. Program content is accepted based on novelty and contributions to the advancement of the field. Accepted technical papers will be published in the ACM and IEEE digital libraries.
TECHNICAL TOPICS
Technical topics include but are not limited to:
- Learning and predictive models for interconnect at various IC and system design stages
- Roadmapping and pathfinding of on-chip interconnect and 2.5D/3D chip-to-chip communication interfaces
- System-level design for FPGAs, NoCs reconfigurable systems, and domain-specific multi/many-core systems
- Design, analysis, and (co)optimization of power, clock distribution networks, and memory partitioning systems
- System-level interconnect reliability, aging, thermal, yield and cost issues
- Topologies and fabrics of multi- and many-core architectures
- Predictive models for power and performance of system-level interconnects
- Interconnects in bio-inspired systems, such as artificial neural networks and quantum architectures
SPECIAL SESSIONS
There are two special sessions this year:
- 3DIC architectures and high-speed interconnects
- DTCO-enhanced power/clock distribution and EDA flows
FORMAT
More interactive, workshop-like tone and format despite it is held virtual this year exceptionally. The workshop includes keynotes, regular paper sessions, interactive panels, tutorials, invited talks, and interactive poster sessions.
SUBMISSION
We invite authors to submit papers of 4 to 8 pages, double-columned, 9pt/10pt font in ACM proceedings format available at: https://www.acm.org/publications/proceedings-template. To permit double blind review, all papers must remove author information. Authors should submit papers electronically: https://easychair.org/conferences/?conf=slip2021
Content is submitted to IEEEXplore
To accommodate the authors who need more time to submit their papers, SLIP 2021 will have a late paper submission deadline of September 5, 2021, with feedback provided in mid-September.
IMPORTANT DATES
Abstract Registration: July 9, 2021 August 8, 2021
Paper Submission: July 30, 2021 August 15, 2021, September 5, 2021 (late papers)
Author Notification: September 10, 2021 August 31, 2021, September 20, 2021 (late papers)
Final Version Upload: October 1, 2021 September 30, 2021
GENERAL CHAIR
Mustafa Badaroglu Qualcomm, Belgium
STEERING COMMITTEE CHAIR
Dirk Stroobandt Ghent University, Belgium
TECHNICAL PROGRAM CO-CHAIRS
Brian Cline ARM, USA
Ismail Bustany Xilinx, USA
SPECIAL SESSION CO-CHAIRS
Pascal Vivet CEA, France
Yuzo Fukuzaki TechInsights, Canada
FINANCE CHAIR
Ivan Ciofi imec, Belgium
PUBLICITY CHAIR
Poona Bahrebar Ghent University, Belgium
PUBLICATIONS CHAIR
Seungwon Kim University of California, San Diego, USA
STEERING COMMITTEE
Andrew Kahng University of California, San Diego, USA
Dirk Stroobandt Ghent University, Belgium
Baris Taskin Drexel University, USA
PROGRAM COMMITTEE
Ivan Ciofi imec, Belgium
Shantanu Dutt University of Illinois at Chicago, USA
Payman Zarkesh-Ha University of New Mexico, USA
Rasit Topaloglu IBM, USA
Titash Rakshit Qualcomm, USA