 | IEEE SPI 2024: 28th IEEE Workshop on Signal and Power Integrity Hotel Olissippo Oriente (Parque das Nações) Lisbon, Portugal, May 12-15, 2024 |
| Conference website | https://spi2024.av.it.pt/ |
| Submission link | https://easychair.org/conferences/?conf=ieeespi2024 |
| Full Paper Submission | January 12, 2024 |
| Notification of Acceptance | February 5, 2024 |
| Early Bird Registration | March 15, 2024 |
| Final Paper Submission | March 15, 2024 |
| Student Awards Application | March 15, 2024 |
| Sponsors Registration | April 5, 2024 |
Standing for almost three decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a noteworthy forum of exchange on all aspects of Signal and Power Integrity, comprising the latest research and developments on design, characterization, modeling, simulation and testing at chip, package, board, and system level. The workshop brings together developers and researchers from academia and industry in order to encourage cooperation.
In view of previous years success, the Committees are hardworking on the 28th Edition which will be held as an in-person event in Lisbon, Portugal. The technical program will include both oral and poster sessions, and several prominent experts will be giving keynotes and tutorials on areas of emerging interest.
Instructions for manuscript submission are available in our Submissions menu. Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:
- Modeling and simulation for SI/PI
- Coupled signal and power integrity analysis
- Noise reduction and equalization techniques
- High-speed link design and modeling
- Power distribution networks
- RF/microwave/mm-wave systems and packaging solutions
- Antennas-in-package and antennas-on-chip
- 3D IC and packages (TSV/SiP/SoC)
- Nano-interconnects and nano-structures
- Electromagnetic theory and modeling
- Transmission line theory and modeling
- Macromodeling, reduced order models
- Electromagnetic compatibility
- Design methodology/flow measurements
- Jitter and noise modeling
- Stochastic/sensitivity analysis
- Electro-thermal modeling
- Chip-package co-design
- Novel CAD concepts
- Optical interconnects
- AI in electronics design
Accepted papers will be included in the workshop's program and submitted for inclusion into IEEE Xplore (subject to meeting scope and quality requirements for IEEE Xplore). Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology.
- AWARDS -
- BEST PAPER AWARD: The SPI 2024 Best Paper Award will recognize the foremost paper among all papers submitted and presented during the workshop.
- BEST STUDENT PAPER AWARD & IEEE EPS STUDENT TRAVEL GRANTS: The Student Awards aim to encourage graduate students to attend the workshop and present their current research work. If you are a student enrolled in a recognized academic graduate degree program and plan to submit a paper, check the Rules and Procedures to apply.
- SPONSORSHIPS -
A main goal for SPI 2024 will be to provide an exceptional level of international exposure for Companies interested in sponsoring the event, by promoting their products and services to all participants, as well as significantly enhancing their visibility and reputation on Signal and Power Integrity expertise. Join us as Sponsor!
IMPORTANT DATES:
- Full Paper Submission: January 12th, 2024
- Notification of Acceptance: February 5th, 2024
- Final Paper Submission: March 15th, 2024
- Student Awards Application: March 15th, 2024
- Early Bird Registration: March 15th, 2024
- Sponsors Registration: April 5th, 2024
Follow us on LinkedIn and feel free to look into our website for further information about SPI 2024, as well as broadcast the workshop in your institution and to your fellow colleagues and students. It is a pleasure to invite you all to the 28th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!