IEEE SPI 2026: 30th IEEE Workshop on Signal and Power Integrity Politecnico di Torino Turin, Italy, June 14-17, 2026

About SPI

Celebrating a notable thirty-year anniversary in 2026, the IEEE Workshop on Signal and Power Integrity (SPI) is an annual scientific event in Europe that stands today as a premier forum of exchange on all aspects of Signal and Power Integrity, encompassing the latest research and developments on design, characterization, modeling, simulation and testing at chip, package, board, and system levels.

The workshop brings together researchers and developers from academia and industry worldwide, providing a key environment to foster cooperation and knowledge exchange. It offers an engaging program to attendees, which includes keynotes and tutorials on emerging topics presented by renowned experts affiliated with leading institutions and companies, alongside dynamic oral and poster technical sessions on the latest research outcomes, and also valuable networking moments.

Visit our webpage and follow our social media channels to keep updated about the latest SPI 2026 developments, and feel free to broadcast the workshop within your institution or company, as well as to your colleagues and students. It is a pleasure to invite you all to send a contribution and attend the 30th IEEE Workshop on Signal and Power Integrity, taking place as in-person event from June 14 to 17, 2026, in Turin, Italy!

Sponsors: IEEE | IEEE Electronics Packaging Society | IEEE Electromagnetic Compatibility Society | IEEE Microwave Theory and Technology Society

Hosting Organization: Politecnico di Torino

Call for Papers

Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following TOPICS of interest:

• Modeling and simulation for SI/PI
• Coupled signal and power integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®).

Awards & Grants

• SPI 2026 BEST PAPER AWARD - Recognizes the foremost paper among all papers submitted and presented during the workshop.
• SPI 2026 BEST STUDENT PAPER AWARD - Recognizes excellence in research for submitted papers primarily authored and presented by a student at the workshop.
• IEEE EPS STUDENT TRAVEL GRANTS - The IEEE Electronics Packaging Society is pleased to provide a special Travel Grant to two students presenting their work at the workshop. The Grants are intended to support the costs directly tied to the event’s attendance.

Important Dates

• Paper Submission Opening: November 5, 2025
• Full Paper Submission: January 16, 2026
• Notification of Acceptance: February 11, 2026
• Final Paper Submission: March 27, 2026
• Student Award & Grants Application: March 27, 2026
• Early Bird Registration: March 27, 2026
• Sponsors Registration: March 31, 2026