CFP
ISMI2018 + IEEE SMILE 2018: 2018 International Symposium on Semiconductor Manufacturing Intelligence National Tsing Hua University Hsinchu, Taiwan, February 7-9, 2018 |
Conference website | https://dalab.ie.nthu.edu.tw/ISMI2018/ |
Submission link | https://easychair.org/conferences/?conf=ismi2018 |
Full Paper Submission for EI Indexed Proceedings for IEEE Xplore | October 31, 2017 |
Submission of Abstract and Special Session Proposals | October 31, 2017 |
Full Paper/Presentation-only Abstract Submission | November 30, 2017 |
The joint conference of 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) and 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2018) aims to disseminate recent theoretical and methodological developments, applications, and case studies in light of ongoing revolutions for manufacturing intelligence and smart manufacturing.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference.
- Full papers: All papers must be written in English with a maximum length of 6 pages.
List of Topics
- AI & Computational Intelligence for Smart Manufacturing
- Advanced Process Control/ Advanced Equipment Control
- Internet of Things (IOT)
- Virtual Metrology
- Tool Health
- Fault Detection & Classification
- Manufacturing Intelligence
- Evolutionary Algorithms
- Circular Economics
- Green Supply Chain & Sustainability
- Decision Technologies
- Modeling & Decision Analysis
- Augmented Reality
- Virtual Reality
- Simulation Optimization & Applications
- Manufacturing Strategy & Manufacturing Innovation
- Corporate Resource Planning & ERP
- User Experience & Innovative Design
- Smart Production Facilities & Green Fab
- Human-machine Collaboration
- Ergonomics & Safety
- Predictive Maintenance
- Quality & Reliability
- Total Resource Management & Overall Resource Effectiveness
- Semiconductor & High-tech Manufacturing
- Applications of Industrial Engineering & Logistics
Venue
National Tsing Hua University (http://nthu-en.web.nthu.edu.tw/bin/home.php) (special offers of NTHU guest house and hotels nearby are available).
Contact
For more details, please consult Conference Co-Chair, Professor Jei-Zheng Wu (jzwu@scu.edu.tw)