SMILE 2019: 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering Zhejiang University Hangzhou, China, April 19-21, 2019 |
Conference website | http://smile.ieeng.org/ |
Submission link | https://easychair.org/conferences/?conf=smile2019 |
Abstract registration deadline | December 1, 2018 |
Submission deadline | January 31, 2019 |
The joint conference of 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE2019) and 2019 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2019) aims to disseminate recent theoretical and methodological developments, applications, and case studies in light of ongoing revolutions for manufacturing intelligence and smart manufacturing.
Conference Honorary Chair: Professor Andrew Kusiak, University of Iowa Informatics Initiative
Conference Chair: Professor Chen-Fu Chien, Taiwan Tsing Hua University
Submission Guidelines
All papers must be written in English with a maximum length of 5 pages . For paper format, submission, and related information, please visit: http://smile.ieeng.org/ and submission page: https://easychair.org/conferences/?conf=smile2019. For the accepted papers, please download Copyright in conference website by yourself, and send back to email: smile_ismi2019@163.com
List of Topics (as not limited to)
Big Data Analytics & Data Mining for Smart Manufacturing
Industry 4.0 & Cyber-Physical Systems
AI & Computational Intelligence for Smart Manufacturing
Advanced Process Control/ Advanced Equipment Control
Internet of things (IOT)
Virtual Metrology, Tool Health, Fault Detection & Classification
Manufacturing Intelligence, Evolutionary Algorithms
Circular Economics, Green Supply Chain & Sustainability
Decision Technologies, Modeling & Decision Analysis
Augmented Reality, Virtual reality
Simulation Optimization & Applications
Manufacturing Strategy & Manufacturing Innovation
Corporate Resource Planning & ERP
User Experience & Innovative Design
Smart Production Facilities & Green Fab
Human-machine Collaboration, Ergonomics & Safety
Predictive Maintenance, Quality & Reliability
Total Resource Management & Overall Resource Effectiveness
Semiconductor & High-tech Manufacturing
Applications of Industrial Engineering & Logistics
Important Dates
Deadline for submission of abstract/ special session proposals: December 1, 2018
Deadline for Full Paper Submission for EI indexed proceedings for IEEE Xplore: December 31, 2018
Deadline for Full Paper/Extended Abstract Submission: January 31, 2019
Camera Ready Manuscript Submission: February 28, 2019
Invited Speakers
Professor Dr. Andrew Kusiak
Department of Mechanical and Industrial Engineering at the University of Iowa
Editor-in-Chief of Journal of Intelligent Manufacturing
Professor Dr. Tae-Eog Lee
Department of Industrial & Systems Engineering,KAIST
President of Korea Institute of Industrial Engineers (KIIE)
Professor Dr. Hing Kai Chan
Ningbo Nottingham University
Co-editor of Industrial Management & Data Systems
Others comig soon......
Publication
SMILE 2019 proceedings will be published in IEEE Xplore that is indexed by Ei Compendex. Selected papers will be recommended for reviews and possible publications in special issues of SCI journals.
Venue
The conference will be held in Hangzhou, China.
Contact
All questions about submissions should be emailed to smile_ismi2019@163.com or chiayuhsu@mail.ntut.edu.tw
Sponsors
IEEE Beijing Section, National Tsing Hua University, Tianjin University